Journal of Shanghai Jiao Tong University ›› 2024, Vol. 58 ›› Issue (2): 232-241.doi: 10.16183/j.cnki.jsjtu.2022.322
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CHENG Xiangwei1, ZHANG Daxu1(), DU Yonglong1, GUO Hongbao2, HONG Zhiliang2
Received:
2022-08-24
Revised:
2022-10-10
Accepted:
2022-10-18
Online:
2024-02-28
Published:
2024-03-04
CLC Number:
CHENG Xiangwei, ZHANG Daxu, DU Yonglong, GUO Hongbao, HONG Zhiliang. In-Situ X-Ray CT Characterization of Damage Mechanism of Plain Weave SiCf/SiC Composites Under Compression[J]. Journal of Shanghai Jiao Tong University, 2024, 58(2): 232-241.
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URL: https://xuebao.sjtu.edu.cn/EN/10.16183/j.cnki.jsjtu.2022.322
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