Journal of Shanghai Jiaotong University ›› 2011, Vol. 45 ›› Issue (10): 1489-1492.

• Physics • Previous Articles     Next Articles

Effect of Small Scale on the Healing History of a Void in Stressed Grain

 YANG  Shuai, LIU  Ying, WANG  Xi   

  1. (State Key Laboratory of Ocean Engineering,Shanghai Jiaotong University, Shanghai 200240, China)
  • Received:2010-09-01 Online:2011-10-31 Published:2011-10-31

Abstract: Based on a nonlocal elastic theory, an analytical method was presented to investigate the effects of small scale parameter on the shrinkage rate and the healing time history of a void in stressed grain. The example calculation shows that the effects of the small scale parameter on the shrinkage rate of a void in stressed grain gradually increase as the size of void decreases, and the void in grain is not eliminated only through lattice diffusion due to the small scale effect. The result gives a reference to reveal the selfhealing mechanism of the damage defects in stressed materials subjected to hydrostatic pressures.
Key words:

Key words: small scale parameter, healing rate of void in stressed grain, nonlocal elastic theory, chemical potential, lattice diffusion

CLC Number: