Abstract: In recent years, the nano-scale interconnection scheme based on carbon-based materials has attracted widespread attention and provided a new solution for the interconnect technology of next-generation integrated circuits. Based on the progress made by domestic and foreign researchers in the modeling and characterization of carbon-based interconnections, combined with the related results achieved by our group, the equivalent circuit modeling, as well as the time-delay and thermal characteristics of carbon nanotube (CNT) interconnects in integrated circuit are studied. A systematic comparison is made between the CNT interconnects and traditional copper ones. Finally, a brief introduction of carbon-based heterogeneous interconnect technology and some prospects are given.

Key words: carbon nanotube (CNT), graphene nanoribbon, integrated circuit, interconnect, via structure