Journal of Shanghai Jiaotong University ›› 2018, Vol. 52 ›› Issue (10): 1135-1141.doi: 10.16183/j.cnki.jsjtu.2018.10.001

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Modeling and Characterization of Interconnects with Carbon Nanotubes for Integrated Circuits

TANG Min,WU Linsheng, LI Xiaochun,MAO Junfa   

  1. Key Laboratory of Ministry of Education of Design and Electromagnetic Compatibility of High Speed Electronic Systems, Shanghai Jiao Tong University, Shanghai 200240, China
  • Online:2018-10-18 Published:2018-10-18

Abstract: In recent years, the nano-scale interconnection scheme based on carbon-based materials has attracted widespread attention and provided a new solution for the interconnect technology of next-generation integrated circuits. Based on the progress made by domestic and foreign researchers in the modeling and characterization of carbon-based interconnections, combined with the related results achieved by our group, the equivalent circuit modeling, as well as the time-delay and thermal characteristics of carbon nanotube (CNT) interconnects in integrated circuit are studied. A systematic comparison is made between the CNT interconnects and traditional copper ones. Finally, a brief introduction of carbon-based heterogeneous interconnect technology and some prospects are given.

Key words: carbon nanotube (CNT), graphene nanoribbon, integrated circuit, interconnect, via structure

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