Journal of Shanghai Jiaotong University ›› 2018, Vol. 52 ›› Issue (5): 582-586.doi: 10.16183/j.cnki.jsjtu.2018.05.012
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WANG Yongguang1, WU Zhonghua2,ZHAO Yongwu2,CHEN Yao1,LIU Ping2,LU Xiaolong1,ZHU Yuguang1
Online:
2018-05-28
Published:
2018-05-28
CLC Number:
WANG Yongguang1, WU Zhonghua2,ZHAO Yongwu2,CHEN Yao1,LIU Ping2,LU Xiaolong1,ZHU Yuguang1. Synergy Effect of Nonionic Surfactant and Ultrasonic on the Post-Cleaning of Aluminium Alloy Chemical Mechanical Polishing[J]. Journal of Shanghai Jiaotong University, 2018, 52(5): 582-586.
[1]WEI K H, HUNG C C, WANG Y S, et al. Cleaning methodology of small residue defect with surfactant in copper chemical mechanical polishing post-cleaning[J]. Thin Solid Films, 2016, 618: 77-80. [2]SHIN W K, AN J H, JEONG H D. Investigation of particle adhesion force for green nanotechnology in post-CMP cleaning[J]. International Journal of Precision Engineering and Manufacturing, 2012, 13(7): 1125-1130. [3]LUAN X D, LIU Y L, ZHANG B G, et al. Investigation of the barrier slurry with better defect performance and facilitating post-CMP cleaning[J]. Microelectronic Engineering, 2017, 170: 21-28. [4]HONG J, NIU X H, LIU Y L, et al. Effect of a novel chelating agent on defect removal during post-CMP cleaning[J]. Applied Surface Science, 2016, 378: 239-244. [5]ITANO M, KERN F W J, MIYASHITA M, et al. Particle removal from silicon wafer surface in wet cleaning process[J]. IEEE Transactions on Semiconductor Manufacturing, 1993, 6(3): 258-267. [6]曹宝成, 于新好, 马瑾, 等. 用含表面活性剂和螯合剂的清洗液清洗硅片的研究[J]. 半导体学报, 2001, 22(9): 1226-1229. CAO Baocheng, YU Xinhao, MA Jin, et al. Study of silicon wafer cleaning effects using clean solutions containing surfactants and chelates[J]. Chinese Journal of Semiconductors, 2001, 22(9): 1226-1229. [7]WANG Y G, CHEN Y, ZHAO Y W. Chemical mechanical planarization of silicon wafers at natural pH for green manufacturing[J]. International Journal of Precision Engineering and Manufacturing, 2015, 16(9): 2049-2054. [8]QIN K, LI Y. Mechanisms of particle removal from silicon wafer surface in wet chemical cleaning process[J]. Journal of Colloid and Interface Science, 2003, 261(2): 569-574. [9]BUSNAINA A A, LIN H, MOUMEN N, et al. Particle adhesion and removal mechanisms in post-CMP cleaning processes[J]. IEEE Transactions on Semiconductor Manufacturing, 2002, 15(4): 374-382. [10]史霄, 郭春华, 杨师, 等. CMP设备兆声清洗原理及应用[J]. 电子工业专用设备, 2015, 44(11): 32-35. SHI Xiao, GUO Chunhua, YANG Shi, et al. The megasonic cleaning theory and its application in the post CMP cleaning[J]. Equipment for Electronic Products Manufacturing, 2015, 44(11): 32-35. [11]CHEREPY N J, SHEN T H, ESPOSITO A P, et al. Characterization of an effective cleaning procedure for aluminum alloys: Surface enhanced Raman spectroscopy and zeta potential analysis[J]. Journal of Colloid and Interface Science, 2005, 282(1): 80-86. |
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