Journal of Shanghai Jiaotong University ›› 2014, Vol. 48 ›› Issue (03): 367-371.

• Radiao Electronics, Telecommunication Technology • Previous Articles     Next Articles

Optics Simulation and Process Research of Backside Gap Exposure

ZHU Jun,CHEN Xiang
  

  1. (Research Institute of Micro/ Nanometer Science and Technology, Shanghai Jiaotong University, Shanghai 200240, China)
  • Received:2013-08-12 Online:2014-03-28 Published:2014-03-28

Abstract:

Backside gap exposure is a new method for fabricating three-dimensional structure using optical diffraction effect. In this paper, the inclined angle and dimension of SU-8 three-dimensional structure were simulated using Matlab and the corresponding experimental study was conducted. The results demonstrate that backside gap exposure is a feasible way to fabricate three-dimensional structure. Simulation and experiment results reveal the same regularity that the inclined angle of side wall depends on the size of the gap, and the dimension of microstructure changes with exposure time if the size of the gap is constant.

Key words: backside gap exposure, three-dimensional microstructure, SU-8 photo resist

CLC Number: