Abstract: An integrated cooling simulation method for the temperature field of the panel during the forming process was proposed. The simulation system for the optimization of processing parameters and inmold cooling system structure design was developed. A finitedifference method based local onedimensional transient analysis in the thickness direction is adopted for the panel part. A threedimensional, boundary element method is used for the numerical implementation of the heat transfer analysis in the mold region. The part and mold analysis are coupled so as to match the temperature and heat flux on the glassmold interface. This paper presented an integrated and coupled numerical model for analyzing the panel cooling process. The numerical results are in good agreement with the experimental ones.