Journal of Shanghai Jiao Tong University

Journal of Shanghai Jiaotong University

• Metallography and Metallurgical Technology • Previous Articles     Next Articles

OrthogonalTesting Experimental on MicroUltrasonicMachining of MicrocrystallineMicaCeramic

WANG Dan,ZHAO Wansheng,KANG Xiaoming,GU Lin,WEI Hongyu   

  1. OrthogonalTesting Experimental on MicroUltrasonicMachining of MicrocrystallineMicaCeramicWANG Dan,ZHAO Wansheng,KANG Xiaoming,GU Lin,WEI Hongyu(School of Mechanical Engineering, Shanghai Jiaotong University, Shanghai 200240, China)Abstract： Microultrasonicmachining (microUSM) experiments were carried out on 530 μmthick microcrystallinemicaceramic（MCMC）slices with workpiece vibration and using silver tungsten alloy as tool materials. The experiments were designed by orthogonaltesting method considering five factors and two levels to investigate the influences of ultrasonic amplitude, tool feed rate, tool rotate speed, abrasive particle size and abrasive concentration on tool volume wear rate in the microUSM of MCMC. Based on the experiments, a 80 μm through hole was machined successfully on 530 μmthick MCMC slice with the optimized microUSM parameters, and the taper of the hole is less than 0.5°.Key words： microultrasonicmachining (microUSM); microcrystallinemicaceramic (MCMC）; orthogonaltesting
  • Received:2009-05-06 Revised:1900-01-01 Online:2010-01-29 Published:2010-01-29

Abstract: Microultrasonicmachining (microUSM) experiments were carried out on 530 μmthick microcrystallinemicaceramic（MCMC）slices with workpiece vibration and using silver tungsten alloy as tool materials. The experiments were designed by orthogonaltesting method considering five factors and two levels to investigate the influences of ultrasonic amplitude, tool feed rate, tool rotate speed, abrasive particle size and abrasive concentration on tool volume wear rate in the microUSM of MCMC. Based on the experiments, a 80 μm through hole was machined successfully on 530 μmthick MCMC slice with the optimized microUSM parameters, and the taper of the hole is less than 0.5°.

CLC Number: