基于横向磁通的包装机横封感应加热建模及仿真

上海交通大学学报（自然版） ›› 2011, Vol. 45 ›› Issue (06): 831-836.

基于横向磁通的包装机横封感应加热建模及仿真

李雷，王石刚，莫锦秋，韦晓晖

(上海交通大学机械与动力工程学院，上海 200240)

收稿日期:2010-06-01 出版日期:2011-06-29 发布日期:2011-06-29
基金资助:
国家自然科学基金资助项目（50875196）

Modeling and Simulation of Transverse FluxBased Induction Heating in Transverse Seal of Packaging Machine

LI Lei, WANG Shi-Gang, MO Jin-Qiu, WEI Xiao-Hui

(School of Mechanical Engineering, Shanghai Jiaotong University, Shanghai 200240, China)

Received:2010-06-01 Online:2011-06-29 Published:2011-06-29

摘要/Abstract

摘要： 针对包装机横封时的温度分布问题，对横封感应加热的温度场进行了数值建模和计算.在横向磁通原理的基础上，结合横封过程和所用铝塑复合包材的特点，研究了横封感应加热的电磁场和温度场描述方程和边界条件，建立了适用于包装机横封感应加热的电磁场和温度场的数学模型.利用大型通用有限元分析软件ANSYS对感应加热的涡流场和温度场进行了仿真.通过分析包材封合截面的各向温度分布情况，证明模拟实际工况下的温度分布满足封合要求.仿真结果为工程应用提供了参考.

关键词: 场包装机, 横封, 横向磁通感应加热, 涡流场, 温度场

Abstract: Due to the issue of temperature distribution of transverse sealing in packaging machine, the temperature field of induction heating was analyzed through numerical modeling and calculation. Based on the principle of transverse flux induction, the equations and boundary conditions of the electromagnetic field and the temperature field were deduced. The process of transverse seal and the structure of aluminumpolyethylene composite package materials were considered. Furthermore, the mathematic and the finite element models of electromagnetic field and temperature field that apply to the transverse sealing of packaging machine were established. Using the finite element software ANSYS, the eddy current field and the temperature field were animated. By analyzing the temperature distribution of different directions in the sealsection of the package material, the simulation results show that the temperature distribution in the actual conditions meets the qualification of transverse seal and provide practical references for engineering application.

Key words: packaging machine, transverse seal, transverse flux induction heating, eddy current field, temperature field

中图分类号:

TM924.5

李雷, 王石刚, 莫锦秋, 韦晓晖. 基于横向磁通的包装机横封感应加热建模及仿真[J]. 上海交通大学学报（自然版）, 2011, 45(06): 831-836.

LI Lei, WANG Shi-Gang, MO Jin-Qiu, WEI Xiao-Hui. Modeling and Simulation of Transverse FluxBased Induction Heating in Transverse Seal of Packaging Machine[J]. Journal of Shanghai Jiaotong University, 2011, 45(06): 831-836.

参考文献

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