Abstract: Interfacial heat transfer is a key issue in many solidification processes. In the paper, a novel experimental apparatus has been designed and on this basis, the instantaneous interfacial heat transfer between molten steel or solidified shell and copper substrate during the first 0.2 s has been studied. The investigated parameters include melt superheat, substrate temperature and surface roughness. The results show that the peak value of the interfacial heat flux in the first stage of liquid/solid contact increases with melt superheat and changes slightly with substrate temperature and surface roughness. The interfacial heat flux in the stage of solid/solid contact has a similar trend of slow decrease in most conditions. © 2011 Shanghai Jiaotong University and Springer-Verlag Berlin Heidelberg.

Key words: heat flux; interfacial heat transfer; rapid solidification