[1] |
NARASIMHAN V, LI H, JIANMIN M. Micromachined high-g accelerometers: A review [J]. Journal of Micromechanics and Microengineering, 2015, 25(3): 033001.
|
[2] |
RUZZA G, GUERRIERO L, REVELLINO P, et al. Thermal compensation of low-cost MEMS accelerometers for tilt measurements [J]. Sensors, 2018, 18(8): 2536.
|
[3] |
HAN J, ZHAO Z, NIU W, et al. A low cross-axis sensitivity piezoresistive accelerometer fabricated by masked-maskless wet etching [J]. Sensors and Actuators A: Physical, 2018, 283: 17-25.
|
[4] |
DONG J, LONG Z, JIANG H, et al. Monolithic-integrated piezoresistive MEMS accelerometer pressure sensor with glass-silicon-glass sandwich structure [J]. Microsystem Technologies, 2017, 23(5): 1563-1574.
|
[5] |
XIAO D B, LI Q S, HOU Z Q, et al. A novel sandwich differential capacitive accelerometer with symmetrical double-sided serpentine beam-mass structure [J]. Journal of Micromechanics and Microengineering, 2016, 26(2): 025005.
|
[6] |
CHAE J, KULAH H, NAJAFI K. A CMOS-compatible high aspect ratio silicon-on-glass in-plane micro-accelerometer [J]. Journal of Micromechanics and Microengineering, 2005, 15(2): 336-345.
|
[7] |
FAN K, CHE L, XIONG B, et al. A silicon micromachined high-shock accelerometer with a bonded hinge structure [J]. Journal of Micromechanics and Microengineering, 2007, 17(6): 1206.
|
[8] |
SABATO A, NIEZRECKI C, FORTINO G. Wireless MEMS-based accelerometer sensor boards for structural vibration monitoring: A review [J]. IEEE Sensors Journal, 2017, 17(2): 226-235.
|
[9] |
SHEN S, CHEN J, BAO M. Analysis on twin-mass structure for a piezoresistive accelerometer [J]. Sensors and Actuators A: Physical, 1992, 34(2): 101-107.
|
[10] |
CRESCINI D, MARIOLI D, TARONI A. Low-cost accelerometers: Two examples in thick-film technology [J]. Sensors and Actuators A: Physical, 1996, 55(2/3): 79-85.
|
[11] |
DONG J, LI X, WANG Y, et al. Silicon micromachined high-shock accelerometers with a curved-surface-application structure for over-range stop protection and free-mode-resonance depression [J]. Journal of Micromechanics and Microengineering, 2002, 12(6): 742-746.
|
[12] |
MO Y, DU L, QU B, et al. Squeeze film air damping ratio analysis of a silicon capacitive micromechanical accelerometer [J]. Microsystem Technologies, 2018, 24(2): 1089-1095.
|
[13] |
KAVITHA C, MADHAN M G. Study of squeeze film damping characteristics under different gas mediums in a capacitive MEMS accelerometer [J]. Journal of the Brazilian Society of Mechanical Sciences and Engineering, 2016, 38(1): 241-252.
|
[14] |
BAO M. Chapter 3: Air damping [M]//Micro mechanical transducers-pressure sensors, accelerometers and gyroscopes. Amsterdam: Elsevier, 2000: 89-137.
|
[15] |
HSIEH H S, CHANG H C, HU C F, et al. Method for performance improvement and size shrinkage of a three-axis piezoresistive accelerometer with guard-ring structure [C]//SENSORS, 2012 IEEE. Taipei: IEEE, 2012: 1-4.
|
[16] |
ROY A L, SARKAR H, DUTTA A, et al. A high precision SOI MEMS-CMOS ±4g piezoresistive accelerometer [J]. Sensors and Actuators A: Physical, 2014, 210: 77-85.
|
[17] |
WEI C, ZHOU W, WANG Q, et al. TPMS (tire-pressure monitoring system) sensors: Monolithic integration of surface-micromachined piezoresistive pressure sensor and self-testable accelerometer [J]. Microelectronic Engineering, 2012, 91: 167-173.
|