Journal of Shanghai Jiaotong University ›› 2013, Vol. 47 ›› Issue (05): 709-714.

• Mechanical instrumentation engineering • Previous Articles     Next Articles

Modeling and Simulation of Surface Roughness for Spherical Grinding

LUO Rui,XU Liming,ZHA Tijian,YANG Ziqi,SHI Lun,HU Dejin   

  1. (School of Mechanical Engineering, Shanghai Jiaotong University, Shanghai 200240, China)
  • Received:2012-05-23 Online:2013-05-28 Published:2013-05-28

Abstract:

A new analytical surface roughness model was developed on the basis of chip thickness model considering the effect of overlapping of multiple abrasive particles. The influences of grinding process parameters on surface roughness were studied. The model was validated by the experimental results of spherical grinding. The theoretical values agree reasonably well with the experimental results.
 

Key words: spherical grinding, modeling of surface roughness, grinding trajectories, chip thickness

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