Abstract: Chiponglass (COG) is one of the promising technologies in liquidcrystaldisplay packaging. This paper executed a thermalstructure coupling field to simulate the warpage in thermocompression bonding with nonconductive film(NCF). The results reveal that the temperature of bonding head is the most important factor on COG warpage, the bonding force and temperature of substrate decline to influence COG warpage in sequence. Although increasing the thickness of substrate can decrease warpage, the change of IC thickness has not a strong relationship to warpage. This is expressed that the thicker substrate enhances the resistance of deformation for the whole COG module, which suppresses warpage effectively.4