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主管：中华人民共和国教育部
主办：上海交通大学
ISSN 1006-2467 CN 31-1466/U
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Journal of Shanghai Jiao Tong University
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中文
Effect of Bonding Parameters and Chip/Substrate Thickness on Warpage of ChiponGlass Packaged with Nonconductive Film
ZHANG Jianhuaa,b,YUAN Fangb,ZHANG Jinsongb
Journal of Shanghai Jiaotong University . 2010, (
01
): 116 -0119 .
