Finite element modeling of hydrostatic stress distribution in copper dual-damascene interconnects

Sponsored by the Ministry of Education of the People's Republic of China
Directed by Shanghai Jiao Tong University
ISSN 1007-1172 CN 31-1943/U

Yuan G.-J.; Chen L.

J Shanghai Jiaotong Univ Sci . 2011, (3): 302 -306 . DOI: 10.1007/s12204-011-1148-x