Materials

Calculation of Electrostatic/Magnetic Adhesion Force Between Adjacent Objects Considering Thin Gap Effect

Expand
  • (1. Department of Engineering Mechanics, Dalian University of Technology, Dalian 116024, Liaoning, China; 2. Anhui Transport Consulting & Design Institute Co., Ltd., Hefei 230088, China; 3. INTESIM (Dalian) Co., Ltd., Dalian 116023, Liaoning, China)

Received date: 2019-04-23

  Accepted date: 2019-10-23

  Online published: 2023-03-21

Abstract

This paper presents a new approach to evaluating the electrostatic/magnetic adhesion force between two adjacent objects separated by a thin gap. In this approach, instead of generating mesh for the gap, a contact boundary is introduced in the finite element modeling to obtain a reasonable field distribution; then the field in the gap is approximated based on the continuity condition at their interface, so that the adhesion force can be properly calculated. Moreover, a simple equivalent circuit model is introduced to explain how the thin gap influences the adhesion force significantly. Numerical experiments are given to demonstrate the validity of the proposed method and the significance of the thin gap.

Cite this article

JIANG Peng (江 鹏), LI Zhibin (李志彬), ZHANG Long (张 龙), LI Jing (李 敬), ZHANG Qun (张 群), GUAN Zhenqun∗ (关振群) . Calculation of Electrostatic/Magnetic Adhesion Force Between Adjacent Objects Considering Thin Gap Effect[J]. Journal of Shanghai Jiaotong University(Science), 2023 , 28(2) : 213 -219 . DOI: 10.1007/s12204-021-2317-1

References

[1]ASANO K, HATAKEYAMA F, YATSUZUKA K. Fundamental study of an electrostatic chuck for silicon wafer handling [J]. IEEE Transactions on Industry Applications, 2002, 38(3): 840-845.
[2]YATSUZUKA K, HATAKEYAMA F, ASANO K, et al. Fundamental characteristics of electrostatic wafer chuck with insulating sealant [J]. IEEE Transactions on Industry Applications, 2000, 36(2): 510-516.
[3]TAGHIZADEH M, GHAFFARI A, NAJAFI F. Modeling and identification of a solenoid valve for PWM control applications [J]. Comptes Rendus M′ecanique, 2009, 337(3): 131-140.
[4]MEUNIER G. The finite element method for electromagnetic modeling [M]. London: ISTE, 2008.
[5]PRAHLAD H, PELRINE R, STANFORD S, et al. Electroadhesive robots — wall climbing robots enabled by a novel, robust, and electrically controllable adhesion technology [C]//IEEE International Conference on Robotics and Automation. Pasadena: IEEE, 2008: 3028-3033.
[6]BERENGUERES J, TADAKUMA K, KAMOI T, et al. Compliant distributed magnetic adhesion device for wall climbing [C]//IEEE International Conference on Robotics and Automation. Roma: IEEE, 2007: 1256-1261.
[7]MAO J, QIN L, ZHANG W. Modeling and simulation of electrostatic adhesion force in concentric-ring electrode structures of multilayer dielectrics [J]. The Journal of Adhesion, 2016, 92(4): 319-340.
[8]CHEN R, HUANG Y, TANG Q, et al. Modelling and analysis of the electrostatic adhesion performance considering a rotary disturbance between the electrode panel and the attachment substrate [J]. Journal of Adhesion Science and Technology, 2016, 30(21): 2301-2315.
[9]CHEN R, HUANG Y, TANG Q. An analytical model for electrostatic adhesive dynamics on dielectric substrates [J]. Journal of Adhesion Science and Technology, 2017, 31(11): 1229-1250.
[10]LHERNOULD M S, DELCHAMBRE A, RE′GNIER S, et al. Electrostatic forces in micromanipulations: Review of analytical models and simulations including roughness [J]. Applied Surface Science, 2007, 253(14): 6203-6210.
[11]LHERNOULD M S, BERKE P, MASSART T J, et al. Variation of the electrostatic adhesion force on a rough surface due to the deformation of roughness asperities during micromanipulation of a spherical rigid body [J]. Journal of Adhesion Science and Technology, 2009, 23(9): 1303-1325.
[12]REN Z, CENDES Z. Shell elements for the computation of magnetic forces [J]. IEEE Transactions on Magnetics, 2001, 37(5): 3171-3174.
[13]FU W N, ZHOU P, LIN D, et al. Magnetic force computation in permanent magnets using a local energy coordinate derivative method [J]. IEEE Transactions on Magnetics, 2004, 40(2): 683-686.
[14]FU W N, HO S L, CHEN N N. Application of shell element method to 3D finite-element computation of the force on one body in contact with others [J]. IEEE Transactions on Magnetics, 2010, 46(11): 3893-3898.
[15]CHOI H S, PARK I H, LEE S H. Concept of virtual air gap and its applications for force calculation [J]. IEEE Transactions on Magnetics, 2006, 42(4): 663-666.
[16]SEO J H, CHOI H S. Computation of magnetic contact forces [J]. IEEE Transactions on Magnetics, 2014, 50(2): 525-528.
[17]CHOI H S, LEE S H, KIM Y S, et al. Implementation of virtual work principle in virtual air gap [J]. IEEE Transactions on Magnetics, 2008, 44(6): 1286-1289.
[18]YOO J, CHOI J S, HONG S J, et al. Finite element analysis of the attractive force on a Coulomb type electrostatic chuck [C]//2007 International Conference on Electrical Machines and Systems (ICEMS). Seoul: IEEE, 2007: 1371-1375.
[19]ZHU Y Y, CESCOTTO S. Transient thermal and thermomechanical analysis by mixed FEM [J]. Computers & Structures, 1994, 53(2): 275-304.
[20]DRIESEN J, BELMANS R J M, HAMEYER K. Finite-element modeling of thermal contact resistances and insulation layers in electrical machines [J]. IEEE Transactions on Industry Applications, 2001, 37(1): 15-20.
Outlines

/