×
模态框(Modal)标题
在这里添加一些文本
Close
Close
Submit
Cancel
Confirm
×
模态框(Modal)标题
×
主管:中华人民共和国教育部
主办:上海交通大学
ISSN 1006-2467 CN 31-1466/U
导航切换
Journal of Shanghai Jiao Tong University
Home
About Journal
Editorial Board
Open Access
Indexed in
Guide for Authors
Subscribe
Contacts Us
中文
Numerical Simulation and Tests on Inflation of an Airship Envelope Model with Cutting Pattern Effects
LI Yi,CHEN Wujun,GAO Chengjun,WANG Xueming,HE Wei
Journal of Shanghai Jiaotong University . 2020, (
3
): 277 -284 . DOI: 10.16183/j.cnki.jsjtu.2020.03.007