Journal of Shanghai Jiao Tong University

Journal of Shanghai Jiaotong University >

2023 , Vol. 57 >Issue 2: 194 - 200

DOI: https://doi.org/10.16183/j.cnki.jsjtu.2021.254

Materials Science and Engineering

Thermal Conductivity of Bulk Attapulgite Prepared by Pressureless Sintering

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  • a. School of Materials Science and Engineering, Shanghai Jiao Tong University, Shanghai 200240, China
    b. School of Mechanical Engineering, Shanghai Jiao Tong University, Shanghai 200240, China

Received date: 2021-07-12

  Revised date: 2021-08-28

  Accepted date: 2021-08-30

  Online published: 2022-08-11

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Abstract

To explore the potential of attapulgite as thermal barrier materials, bulk attapulgite samples were prepared by pressureless sintering. The effects of sintering temperature on the phase composition, porosity, microstructure, and thermal conductivity of bulk attapulgite were investigated. With increasing sintering temperature, bulk attapulgite transforms from predominant quartz phase (700 ℃) to coexistence of quartz and enstatite phases (800—900 ℃), and to coexistence of quartz, enstatite and cristobalite phases (1000—1200 ℃). Meanwhile, the microstructure of the bulk attapulgite changes from random, loose packed fiber-like porous morphology, to dense structure with a random distribution of MgO·SiO2 grains inside the SiO2 matrix to result in a significant decrease in porosity. The thermal conductivity of bulk attapulgite increases with increasing temperature. When sintered at 700 ℃, bulk attapulgite presents a temperature-independent thermal conductivity with an ultra-low value of 0.16 W/(m·K) at room temperature. Attapulgite, with its natural abundance and low cost, along with the ultra-low thermal conductivity, has a great potential as thermal barrier materials.

Key words： attapulgite; pressureless sintering; thermal conductivity; thermal barrier materials

Cite this article

SUN Xucheng, ZHAO Xiaofeng, YANG Fan . Thermal Conductivity of Bulk Attapulgite Prepared by Pressureless Sintering[J]. Journal of Shanghai Jiaotong University, 2023 , 57(2) : 194 -200 . DOI: 10.16183/j.cnki.jsjtu.2021.254

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