Liquid crystal polymer (LCP) with excellent microwave and millimeter-wave properties is widely applied in high frequency multilayer substrates. The design of an excellent via-hole transition in multilayer circuits board is important to employ as an interconnect to route signal traces on different layers or connect components. Recently, with the operating frequency increasing, the problem of discontinuity in the via-hole transition structure has become increasingly prominent. Therefore, electromagnetic modeling of via-plate-pair structures is essential for the design of microwave and millimeter-wave circuits. In this paper, an efficient and fast via-hole transition modeling method for the ground coplanar waveguide-strip line-ground coplanar waveguide(GCPW-SL-GCPW) structure based on the four-layer LCP circuit board is proposed. By segmented modeling of the multilayer structure and introducing a fast convergence algorithm in the parasitic parameter calculation process, a via-hole lumped parameter equivalent circuit structure is established. Finally, the equivalent circuit model of the GCPW-SL-GCPW structure is quickly constructed based on the microwave network cascade method. Compared with the full-wave simulation results of HFSS high frequency structure simulator, which is a 3D high-frequency electromagnetic software, it is found that this modeling process is simple and fast. The GCPW-SL-GCPW circuit structure has been fabricated using the LCP multilayer process. The test results show that the test results and the equivalent circuit analysis results are highly consistent in the wide frequency range of 10 MHz—40 GHz, which verifies the effectiveness of the via-hole transition modeling method.