Journal of Shanghai Jiao Tong University

Journal of Shanghai Jiaotong University >

2023 , Vol. 57 >Issue 3: 253 - 263

DOI: https://doi.org/10.16183/j.cnki.jsjtu.2021.312

Mechanical Engineering

Multi-Physics Field Coupling Simulation of Induction Leveling Process

  • Xuyang LIU ,
  • Changru CAI ,
  • Yixi ZHAO ,
  • Liyang JU
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  • 1. Shanghai Key Laboratory of Digital Manufacture for Thin-Walled Structures, Shanghai Jiao Tong University, Shanghai 200240, China
    2. Shanghai Waigaoqiao Shipbuilding Co., Ltd., Shanghai 200137, China

Received date: 2021-08-18

  Accepted date: 2021-10-08

  Online published: 2022-01-11

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Abstract

The electromagnetic induction leveling method has the characteristics of high efficiency and easy operation. It has a good application prospect in the thin plate leveling process. Based on the fixed inline coil induction leveling process used by the shipyard, this research uses COMSOL Multiphysics to establish a three-dimensional electromagnetic-thermal-mechanical coupling induction leveling finite element model. The model inputs the temperature-dependent physical properties as the material properties of the AH36 steel plate, and takes the residual stress and welding deformation of the butt weldment as the initial state. The method of sequential coupling is used to calculate the changes of electromagnetic field, temperature field, and structure field during the leveling process. The two-way coupling relationship between the temperature field and the electromagnetic field is verified and the deformation of the welded part after leveling is obtained. Through the self-built induction leveling experiment platform, the accuracy and effectiveness of the finite element model are verified.

Key words： electromagnetic induction; welding distortion and leveling; multi-physics field coupling; finite element simulation

Cite this article

Xuyang LIU , Changru CAI , Yixi ZHAO , Liyang JU . Multi-Physics Field Coupling Simulation of Induction Leveling Process[J]. Journal of Shanghai Jiaotong University, 2023 , 57(3) : 253 -263 . DOI: 10.16183/j.cnki.jsjtu.2021.312

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