Abstract: Three-dimensional numerical simulation of chip cooling radiator was carried out and the performance of four different radiators and influence of fin thickness were contrastively analyzed. Radiator model and fin thickness with better performance were also obtained. The results indicated that the heat transfer effect in both sides of radiator was better than that in the symmetrical central region, which meant that the heat transfer enhancement in the symmetrical central region should be mainly taken into account in the radiator structural design. The heat transfer coefficient of C-type and D-type radiators was obviously improved compared with A-type and B-type radiators. The temperature of substrate heating surface of C-type was much lower and the performance was better. When the fin thickness was 2mm, the cooling effect of A-type, B-type and C-type radiators was better, while the optimum value of D-type radiator was 2.5mm. 20 kinds of radiators with different structural dimensions were comprehensively analyzed in the study and the characteristics of flow and heat transfer were stated, which provided a theoretical basis and engineering guidance for the structural optimization design of chip cooling radiators.

Key words: chip cooling, radiator, structure optimization, fin thickness, numerical simulation