Journal of Shanghai Jiaotong University ›› 2018, Vol. 52 ›› Issue (12): 1603-1608.doi: 10.16183/j.cnki.jsjtu.2018.12.009

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Numerical Analysis of the UV Curing and Demolding Process for High Aspect Ratio Micro Structure

WU Hao,YI Peiyun,PENG Linfa,LAI Xinmin   

  1. State Key Laboratory of Mechanical System and Vibration, Shanghai Jiao Tong University, Shanghai 200240, China

Abstract: Focusing on the demolding issues of high aspect ratio structures, this paper attempts to explain the reasons behind this problem. Firstly, the material properties of the cured resist was measured, and Ogden model was used to describe its behavior. Then, a roll to roll UV curing and demolding numerical model was constructed and analyzed. It was found that the adhesive forces between mold and structures is the major cause of maximum stress in cured resist when aspect ratio is set to 4∶1. Moreover, a longer curing time, a thinner residual layer thickness, a smaller structure aspect ratio and a bigger structure gap can lead to smaller maximum stress during the curing and demolding process.

Key words: high aspect ratio, roll to roll, curing and demolding, structure defects

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