The relationship between contact force of the adjacent film and layer pitch of the S-fold model was deduced based on linear-elastic engineering theory. The numerical simulation analysis of the folding process was conducted in implicit static method with ABAQUS. Considering continuous and grading loading conditions, repeated elastic and elastic-plastic folding experiments on 50 μm and 125 μm film specimens were conducted to acquire the P-h curve and the creep displacement (Δh). The stress-strain curve and mechanical parameters of the film were obtained from uniaxial tensile tests, which were then applied to theoretical analysis and numerical simulation. The consistency of P-h curve obtained from the three approaches shows that the one-dimensional approximate theory is reasonable and the numerical simulation is effective.