Application of Water-Based Nano-Fluid in Copper Wire Flat Heat Pipe with Mesh Structure

Abstract

Abstract: The heat transfer characteristics of a novel flat heat pipe, the copper wire-bonded and mesh screen flat heat pipe ,were investigated experimentally. The effect of various working pressures, nano-fluid concentration and working fluids which include deionized water and waterbased copper nanofluids on copper wire-bonded and mesh screen flat heat pipe was analyzed. Besides, the performance was compared to that of copper wire-bonded flat heat pipe. The results show that nanofluid under low-pressure conditions can significantly improve the heat transfer characteristics of heat pipe and is a new working medium which can be applied to flat heat pipe. The overall thermal performances of new heat pipe are superior to those of copper wire-bonded flat heat pipe, the thermal resistance reduces distinctly and the maximum power increases obviously.

Key words: flat heat pipe； nano-fluid； heat pipe with mesh screen structure, heat transfer

CLC Number:

TK 124

LI Shuang-Shuang, MA Qi, LIU Zhen-Hua. Application of Water-Based Nano-Fluid in Copper Wire Flat Heat Pipe with Mesh Structure[J]. Journal of Shanghai Jiaotong University, 2013, 47(04): 555-559.

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