Lifetime Analysis of LeadFree Ball Grid Array Solder Joints under Random Vibration

Abstract

Abstract: Four groups of random vibration tests of solder joints were conducted with different power spectral density (PSD) of input acceleration. Proportional hazards model (PHM) was used to evaluate the effect of PSD of input acceleration on the solder joints’ life span. The meantimetofailure (MTTF) and the failure probability density function (PDF) estimated from the PHM agree well with the experimental data, and this validates the effectiveness of the PHM. By the curve of the MTTF s, it can be observed that the MTTF<1 800 s when the amplitude of PSD was greater than 60 m2/s3, and this demonstrates that the lead-free solder joints are very sensitive to random vibration loading. Finally, the estimated lifetime of MTTF was integrated with the Miner’s law for cumulative damage model of lead-free solder joints.

Key words: power spectral density (PSD), proportional hazards model (PHM), meantimetofailure (MTTF), Miner’s law

CLC Number:

TN41

WANG Wen, LIU Fang, YOU Ming-Yi, MENG Guang. Lifetime Analysis of LeadFree Ball Grid Array Solder Joints under Random Vibration[J]. Journal of Shanghai Jiaotong University, 2011, 45(09): 1362-1367.

References

［1］Institute for Clinical and Economic Review. Waste electronic and electrical equipment ［M］. European: The European Union, 2000, 14.

［2］JEIDA. Challenges and efforts toward commercialization of lead free solderroad map 2000 for commercialization of lead free solder ［M］. Japan: Japan Electronic Industry Development Association, 2000.

［3］Suhir E. Could compliant external leads reduce the strength of a surface mounted device? ［C］// 38th Electronic Components and Technology Conference. CA: Los Angeles, 1988: 16.

［4］Suhir E. Is the maximum acceleration an adequate criterion of the dynamic strength of a structural element in an electronic package? ［J］. Components, Packaging, and Manufacturing Technology: Part A, 1997, 20 (7): 513517.

［5］Pitarresi J M, Caletka D V, Caldwell R, et al. The “ smeared ” property technique for the FE vibration analysis of printed circuit cards ［J］. J Electron Packag, 1991,113: 250257.

［6］Pitarresi J M, Primavera A A. Comparison of modeling techniques for the vibration analysis of printed circuit cards ［J］. ASME J Electron Packag, 1992, 114 (4): 378383.

［7］Pitarresi J, Geng P, Yun L. Dynamic modeling and measurement of personal computer motherboards［C］// Electronic Components and Technology Conference. CA: San Diego, 2002: 597603.

［8］Perkins A, Sitaraman S K. Analysis and prediction of vibrationinduced solder joint failure for a ceramic column grid array package［J］. Journal of Electronic Packaging, 2008, 130 (1): 011012.111.

［9］Che F X, Pang John H L. Vibration reliability test and finite element analysis for flip chip solder joints［J］. Microelectronics Reliability, 2009, 49 (7): 754760.

［10］Grieu M, Massiot G, Maire O, et al. Durability modeling of a BGA component under random vibration［C］// Proceedings of 9th Int Conf on Thermal, Mechanical and MultiPhysics Simulation and Experiments in MicroElectronics and MicroSystems. USA: IEEE, 2008: 18.

［11］Grieu M, Maire O, Massiot G, et al. Sn3.0Ag0.5Cu solder joints lifetime estimation for electronic assemblies under random vibration［C］// Electronic SystemIntegration Technology Conference(ESTC 2008).London:University of Greenwich, 2008:175180.

［12］Liu Fang, Meng Guang, Zhao Mei, et al. Board level drop test analysis based on modal test and simulation［J］. Journal of Electronic Packaging, 2008, 130 (2): 021007.16.

［13］Chevalier R, Garnero M A, Jardine A K S, et al. Optimizing CM data from EDF main rotating equipment using proportional hazard model［C］ //Surveillance 5 Conference. France: Senlis Press, 2004.

［14］Danielyan S A, Zharinov G M, Osipova T T. Application of the principal components method and the proportional hazards regression model to analysis of survival data［J］. Biometrical Journal, 1986, 28 (1): 7379.

［15］Gao Y. Application of DPCA to oil data PH model building and comparison of optimal CBM policies ［M］. Canada: MSC Thesis, University of Toronto, 2003.

［16］Miner M A. Cumulative damage in fatigue ［J］. Journal of Applied Mechanics, 1945(12):159164.

［17］Jardine A K S, Joseph T, Banjevic D. Optimizing conditionbased maintenance decisions for equipment subject to vibration monitoring ［J］. Journal of Quality in Maintenance Engineering, 1999, 5 (3): 192202.

［18］Lin D, Banjevic D, Jardine A K S. Using principal components in a proportional hazards model with applications in conditionbased maintenance ［J］. Journal of Operational Research Society, 2006,57(8):910919.

［19］Makis V, Jardine A K S. Optimal replacement in the proportional hazards model ［J］. INFOR, 1992, 30 (1): 172183.

［20］Banjevic D, Jardine A K S, Makis V, et al. A controllimit policy and software for conditionbased maintenance optimization ［J］. INFOR, 2001, 39 (1): 3250.