上海交通大学学报

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2017 , Vol. 51 >Issue 9: 1083 - 1089

DOI: https://doi.org/10.16183/j.cnki.jsjtu.2017.09.010

兵器工业

 聚合物薄膜表面微结构的粉末热辊压成形工艺

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  •  上海交通大学 上海市复杂薄板结构数字化制造重点实验室

网络出版日期: 2017-09-20

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 RolltoRoll Powder Hot Embossing Process for Fabrication of MicroStructures on Polymer Film

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  •  Shanghai Key Laboratory of Digital Manufacture for Thinwalled Structures,
     Shanghai Jiao Tong University

Online published: 2017-09-20

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摘要

 利用卷对卷热辊压工艺连续、高效和粉末冶金成形技术精度高的优点，提出了一种在聚合物薄膜表面制备微结构粉末的热辊压成形工艺方法，构建了聚合物薄膜表面微结构粉末热辊压成形工艺试验系统并进行了粉末热辊压成形工艺试验，通过单因素试验研究了工艺参数(模具温度、辊压速度和辊压力)对成形质量的影响规律.结果表明，采用模具温度130~145℃，辊压速度0.2~0.8m/min和辊压力250~500N的粉末热辊压成形工艺参数，能够得到聚合物粉末充型完整的微金字塔阵列结构.

关键词：  ; 聚合物薄膜; 微结构; 微金字塔阵列结构; 粉末热辊压; 工艺参数

本文引用格式

舒赟翌，彭林法，易培云，来新民 .  聚合物薄膜表面微结构的粉末热辊压成形工艺[J]. 上海交通大学学报, 2017 , 51(9) : 1083 -1089 . DOI: 10.16183/j.cnki.jsjtu.2017.09.010

Abstract

 This study proposed a rolltoroll (R2R) powder hot embossing process for the fabrication of microstructures on polymer film by combining the merits of R2R hot embossing process and powder metallurgy technology. An R2R powder hot embossing system was developed and a series of embossing experiments were conducted. The influences of processing parameters, which included mold temperature, feeding speed and applied force, had been investigated systematically by using the onevariableatatime (OVAT) method. It was found that the completelyfilled micropyramid arrays could be fabricated by R2R powder hot embossing process under the mold temperature of 130—145℃, the feeding speed of 0.2—0.8m/min and the applied force of 250—500N.

Key words：  polymer film; microstructures; micropyramid arrays; rolltoroll ; (R2R) powder hot embossing; process parameters

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