板级球栅阵列无铅焊点随机振动寿命分析

上海交通大学学报（自然版） ›› 2011, Vol. 45 ›› Issue (09): 1362-1367.

• 无线电电子学、电信技术 • 上一篇下一篇

板级球栅阵列无铅焊点随机振动寿命分析

王文，刘芳，尤明懿，孟光

（上海交通大学机械系统与振动国家重点实验室，上海 200240）

收稿日期:2010-06-05 出版日期:2011-09-30 发布日期:2011-09-30
基金资助:
国家自然科学基金（10325209），中国博士后基金（20090450699）资助项目

Lifetime Analysis of LeadFree Ball Grid Array Solder Joints under Random Vibration

WANG Wen, LIU Fang, YOU Ming-Yi, MENG Guang

(State Key Laboratory of Mechanical System and Vibration,Shanghai Jiaotong University, Shanghai 200240, China)

Received:2010-06-05 Online:2011-09-30 Published:2011-09-30

摘要/Abstract

摘要： 进行了4组加速度的功率谱密度(PSD)条件下的焊点疲劳寿命试验，采用比例风险模型(PHM)分析加速度的PSD对焊点寿命的影响，并采用估计所得寿命期望(MTTF)，结合Miner准则得到板极无铅焊点随机振动寿命损伤累积模型.结果表明：焊点疲劳寿命试验的结果与PHM估计所得焊点寿命的MTTF及其失效概率密度(PDF)吻合较好；当输入加速度的PSD幅值大于60 m2/s3时，焊点的MTTF值小于1 800 s，表明无铅焊点对随机振动载荷非常敏感.

关键词: 功率谱密度, 比例风险模型, 寿命期望值, Miner准则

Abstract: Four groups of random vibration tests of solder joints were conducted with different power spectral density (PSD) of input acceleration. Proportional hazards model (PHM) was used to evaluate the effect of PSD of input acceleration on the solder joints’ life span. The meantimetofailure (MTTF) and the failure probability density function (PDF) estimated from the PHM agree well with the experimental data, and this validates the effectiveness of the PHM. By the curve of the MTTF s, it can be observed that the MTTF<1 800 s when the amplitude of PSD was greater than 60 m2/s3, and this demonstrates that the lead-free solder joints are very sensitive to random vibration loading. Finally, the estimated lifetime of MTTF was integrated with the Miner’s law for cumulative damage model of lead-free solder joints.

Key words: power spectral density (PSD), proportional hazards model (PHM), meantimetofailure (MTTF), Miner’s law

中图分类号:

TN41

王文, 刘芳, 尤明懿, 孟光. 板级球栅阵列无铅焊点随机振动寿命分析[J]. 上海交通大学学报（自然版）, 2011, 45(09): 1362-1367.

WANG Wen, LIU Fang, YOU Ming-Yi, MENG Guang. Lifetime Analysis of LeadFree Ball Grid Array Solder Joints under Random Vibration[J]. Journal of Shanghai Jiaotong University, 2011, 45(09): 1362-1367.

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板级球栅阵列无铅焊点随机振动寿命分析

Lifetime Analysis of LeadFree Ball Grid Array Solder Joints under Random Vibration

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