选择性激光烧结木塑复合材料的制备工艺及成型机理

上海交通大学学报（自然版） ›› 2011, Vol. 45 ›› Issue (09): 1327-1331.

选择性激光烧结木塑复合材料的制备工艺及成型机理

郭艳玲1，姜凯译1，于志祥2，辛宗生1，曾伟梁1

(1. 东北林业大学机电工程学院，哈尔滨 150040；2. 哈尔滨理工大学工程训练中心，哈尔滨 150040)

收稿日期:2010-10-20 出版日期:2011-09-30 发布日期:2011-09-30
基金资助:
国家自然科学基金项目（51075067），黑龙江省科技攻关项目（GC07A510），国家博士后科学基金资助项目(20100480956)，黑龙江省自然科学基金资助项目(E201050)

The Preparation Technology and Forming Properties of WoodPlastic Composite Powder Used in Selective Laser Sintering

GUO Yan-Ling-1, JIANG Kai-Yi-1, YU Zhi-Xiang-2, XIN Zong-Sheng-1, ZENG Wei-Liang-1

(1. School of Mechatronics Engineering, Northeast Forestry University, Harbin 150040, China;2. Engineering Training Center, Harbin University of Science and Technology, Harbin 150040, China)

Received:2010-10-20 Online:2011-09-30 Published:2011-09-30

摘要/Abstract

摘要： 分析了选择性激光烧结木塑复合材料的成型机理，设计了可用于激光烧结的木塑复合材料配方，并通过试验加以验证.结果表明，所制备的木塑复合材料可以满足激光烧结对原材料的要求，其成型件的形状精度较高，未经后处理的成型件拉伸强度为14 kPa，弯曲强度为475 kPa，冲击强度为567 J/m2.

关键词: 选择性激光烧结, 木塑复合材料, 配方设计, 成型机理, 制备工艺

Abstract: This paper studied the prototyping technical principle of wood plastic composite based on selective laser sintering, and designed the formula of the wood plastic composite. And experiments were shown to verify the correctness. The results show that the prepared composite can meet the processing requirements of SLS, the shape precision of the formed parts is high, and the parts reach a certain mechanical index. Before post-processing the tensile strength is 14 kPa, the bonding strength is 475 kPa and the shock strength is 567 J/m2.

Key words: selective laser sintering, woodplastic composite, formula design, forming mechanism, preparation technology

中图分类号:

TB332

郭艳玲1, 姜凯译1, 于志祥2, 辛宗生1, 曾伟梁1. 选择性激光烧结木塑复合材料的制备工艺及成型机理[J]. 上海交通大学学报（自然版）, 2011, 45(09): 1327-1331.

GUO Yan-Ling-1, JIANG Kai-Yi-1, YU Zhi-Xiang-2, XIN Zong-Sheng-1, ZENG Wei-Liang-1. The Preparation Technology and Forming Properties of WoodPlastic Composite Powder Used in Selective Laser Sintering[J]. Journal of Shanghai Jiaotong University, 2011, 45(09): 1327-1331.

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