上海交通大学学报

上海交通大学学报（自然版）

• 一般工业技术 • 上一篇    

芯片封装系统两环闭型排队网络模型性能解析

李娜1，江志斌1，郑力2，庄才华1   

  1. （1.上海交通大学 机械与动力工程学院， 上海 200240； 2.清华大学 工业工程系， 北京 100086）
  • 收稿日期:2009-08-03 修回日期:1900-01-01 出版日期:2010-07-28 发布日期:2010-07-28

Performance Analysis of a Two-Loop Closed Queue Network Model in Semiconductor Assembly System

LI Na1,JIANG Zhibin1,ZHENG Li2,ZHUANG Caihua1   

  1. (1. School of Mechanical Engineering, Shanghai Jiaotong University, Shanghai 200240, China;2. Department of Industrial Engineering, Tsinghua University, Beijing 100086, China)
  • Received:2009-08-03 Revised:1900-01-01 Online:2010-07-28 Published:2010-07-28

摘要： 研究了芯片制造封装生产线上由于存在多种运输车辆而形成的两环闭型排队网络模型，在考虑制造系统随机特性的基础上，构建了问题的数学模型，并提出一种重叠式分解迭代解析算法，获得了系统的产率解析结果.仿真实验和生产应用表明，该算法是有效的.

关键词: 芯片封装测试, 闭环生产系统, 两环闭型排队网络, 分解算法

Abstract: This paper described a system in semiconductor assembly line in which two type of carts cycling around. It is a typical twoloop closed production line. The mathematical model was constructed considering the stochastic character of the line. An approximation algorithm based on the overlapping decomposition philosophy and the iterative procedures to estimate the throughput were proposed. The accuracy of the estimates was studied by the experiments and the real case and it proves that the approximation method is effective.

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