上海交通大学学报

上海交通大学学报（自然版）

• 无线电电子学、电信技术 • 上一篇    下一篇

键合参数和芯片/基板厚度对非导电膜互连封装玻璃覆晶模块芯片翘曲的影响

张建华a,b，袁方b，张金松b   

  1. （上海大学 a.新型平板显示技术及应用集成教育部重点实验室；b.机电工程与自动化学院， 上海 200072）
  • 收稿日期:2009-02-27 修回日期:1900-01-01 出版日期:2010-01-29 发布日期:2010-01-29

Effect of Bonding Parameters and Chip/Substrate Thickness on Warpage of ChiponGlass Packaged with Nonconductive Film

ZHANG Jianhuaa,b,YUAN Fangb,ZHANG Jinsongb   

  1. (a. Key Laboratory of Advanced Display and System Applications of Ministry of Education;b. School of Mechatronics Engineering and Automation, Shanghai University, Shanghai 200072, China)
  • Received:2009-02-27 Revised:1900-01-01 Online:2010-01-29 Published:2010-01-29

摘要： 采用热/结构耦合场对非导电膜互连封装玻璃覆晶（COG）模块芯片（IC）的翘曲进行数值模拟，并分析不同热压键合参数和芯片/基板厚度对液晶显示屏（LCD）翘曲的影响.结果表明：在热压键合过程中，键合头温度对COG模块IC翘曲的影响最为显著，键合压力次之，玻璃基板温度最小； IC厚度对IC翘曲的影响不明显，而增加COG模块中玻璃基板的厚度，可有效降低IC翘曲程度.其原因在于较厚的玻璃基板的耐变形能力较高，从而抑制了翘曲.

关键词: 非导电膜, 玻璃覆晶, 芯片, 键合, 翘曲

Abstract: Chiponglass (COG) is one of the promising technologies in liquidcrystaldisplay packaging. This paper executed a thermalstructure coupling field to simulate the warpage in thermocompression bonding with nonconductive film(NCF). The results reveal that the temperature of bonding head is the most important factor on COG warpage, the bonding force and temperature of substrate decline to influence COG warpage in sequence. Although increasing the thickness of substrate can decrease warpage, the change of IC thickness has not a strong relationship to warpage. This is expressed that the thicker substrate enhances the resistance of deformation for the whole COG module, which suppresses warpage effectively.4

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