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2026 , Vol. 31 >Issue 4: 970 - 980

DOI: https://doi.org/10.1007/s12204-024-2750-z

Automation & Computer Technologies

Influence of Water-Solid Interaction and Surface Charge on Thermal Resistance Length

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  • Institute of Refrigeration and Cryogenics, Shanghai Jiao Tong University, Shanghai 200240, China

Received date: 2023-08-05

  Accepted date: 2023-09-30

  Online published: 2026-07-22

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Abstract

Understanding the particle behavior at the solid-liquid interface and regulating the interfacial thermal resistance is the key to solving the chip heat dissipation problem at extreme heat flux. To this end, non-equilibrium molecular dynamics simulations were used in this study to investigate the effects of water-solid interactions, surface charges, and static structure factors on the thermal resistance length. The number density and temperature profiles show that both water-solid interaction and surface charge determine the density and temperature distribution of the liquid in the system, and there is a competitive relationship between them. The temperature gradient, jump and thermal resistance length were calculated. We found that the thermal resistance length decreases with the increase of the interaction and surface charge mainly because of the drastic change in temperature jump. In particular, enhancing the water-solid interaction can reduce the thermal resistance length from 263.5A to 114.6A by a maximum of 56.5%, while increasing the surface charge can reduce the thermal resistance length from 263.5A to 46.7A by a maximum of 82.3% in the scope of this study. Moreover, it is found that the static structure factor is related to the solid-liquid interaction and the surface charge. For atomic-scale solid-liquid interfaces, the heat transfer performance can be optimized by increasing the peak value of the static structure factor to reduce the thermal resistance length. The findings in this study provide guidance for future studies to evaluate the possible solutions to improve the heat transfer performance of the solid-liquid interface, such as reducing the interfacial thermal resistance, and promoting its application in chip heat dissipation.

Cite this article

Qian Chenyi, Wang Jiaxuan, Ye Zhenhong, Chen Jiangping, Yu Binbin . Influence of Water-Solid Interaction and Surface Charge on Thermal Resistance Length[J]. Journal of Shanghai Jiaotong University(Science), 2026 , 31(4) : 970 -980 . DOI: 10.1007/s12204-024-2750-z

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