Intelligent Robots

Collision Detection for Vacuum Wafer Transfer Robot

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  • 1. College of Mechanical and Electrical Engineering, Hohai University, Changzhou 213200, Jiangsu, China; 2. The 58th Research Institute, China Electronics Technology Group Corporation, Wuxi 214035, Jiangsu, China

Received date: 2025-10-15

  Revised date: 2025-11-13

  Accepted date: 2025-11-15

  Online published: 2026-01-28

Abstract

In response to safety concerns caused by wafer transmission robot collisions in confined vacuum chambers, which can lead to wafer breakage and production line contamination, a collision detection and response method is proposed, leveraging the robot’s dynamics model and adjustable acceleration thresholds. The structure and motion characteristics of the robot were first analyzed. Subsequently, its kinematic and dynamic models were established and validated via simulation. To reduce noise interference, the dynamics model was computed using a reference trajectory from the host planner. Cross-correlation analysis was used to identify phase differences between the planned and encoder feedback trajectories, enabling phase compensation. For collision threshold settings, an acceleration-based adjustment scheme was developed, taking into account potential collision risk levels. Experimental tests on the vacuum robot verified the effectiveness of the proposed method.

Cite this article

Fang Xingyu, Wei Xianming, Sun Jintao, Xu Linsen . Collision Detection for Vacuum Wafer Transfer Robot[J]. Journal of Shanghai Jiaotong University(Science), 2026 , 31(1) : 99 -105 . DOI: 10.1007/s12204-026-2899-8

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