The micro-structure on hard-brittle chip materials (HBCMs) surface can produce predominant functions
and features. The micro-grinding with diamond wheel micro-tip is an efficient method to machine microstructure
on HBCMs. However, different HBCMs and crystal orientation may have a significant influence on the
micro-grinding performance. In this paper, the micro-grinding performance along different crystal orientation of
HBCMs is investigated. First, a dressed 600# diamond grinding wheel is used to micro-grind micro-structure on
HBCMs. Then, the experiment of micro-grinding force test is completed. Finally, the quality of microgroove,
the grinding ratio and the micro-grinding force are investigated and they are related to the crystal orientation
of HBCMs. It is shown that the stronger resistance to the micro-crack propagation has the best quality of microgroove
and the smallest grinding ratio. Moreover, the hardest single-crystal SiC has the best machinability
and the micro-grinding force is 38.9%, 10.8% and 46.8% less than the one of sapphire, single-crystal Si and quartz
glass, respectively. The direction to micro-grind easily is the crystal orientation 10ˉ10 for single-crystal SiC and
sapphire. In addition, the micro-grinding force increases with the increase of the micro-grinding depth and feed
rate and decreases with the increase of the grinding wheel speed.
ZHANG Long (张龙), XIE Jin (谢晋), ZHU Limin (朱利民), LU Yanjun (鲁艳军)
. Micro-Grinding Performance of Hard-Brittle Chip Materials in Precision Micro-Grinding Microgroove[J]. Journal of Shanghai Jiaotong University(Science), 2018
, 23(Sup. 1)
: 70
-76
.
DOI: 10.1007/s12204-018-2025-7
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