电磁感应矫平工艺的多物理场耦合仿真研究

刘徐阳, 蔡昌儒, 赵亦希, 鞠理杨

Multi-Physics Field Coupling Simulation of Induction Leveling Process

LIU Xuyang, CAI Changru, ZHAO Yixi, JU Liyang

图10 上表面与截面磁感应强度与温度分布

Fig.10 Magnetic induction intensity and temperature distribution on the upper surface and cross section