电磁感应矫平工艺的多物理场耦合仿真研究

刘徐阳, 蔡昌儒, 赵亦希, 鞠理杨

Multi-Physics Field Coupling Simulation of Induction Leveling Process

LIU Xuyang, CAI Changru, ZHAO Yixi, JU Liyang

图18 实验与仿真钢板变形量与矫平量对比

Fig.18 Comparison of experimental and simulated steel plate deformation and leveling