电磁感应矫平工艺的多物理场耦合仿真研究 |
刘徐阳, 蔡昌儒, 赵亦希, 鞠理杨 |
Multi-Physics Field Coupling Simulation of Induction Leveling Process |
LIU Xuyang, CAI Changru, ZHAO Yixi, JU Liyang |
图17 实验与仿真钢板温度变化对比 |
Fig.17 Comparison of temperature changes of experimental and simulated steel plate |