电磁感应矫平工艺的多物理场耦合仿真研究

刘徐阳, 蔡昌儒, 赵亦希, 鞠理杨

Multi-Physics Field Coupling Simulation of Induction Leveling Process

LIU Xuyang, CAI Changru, ZHAO Yixi, JU Liyang

图1 感应矫平几何模型(mm)

Fig.1 Geometry model of induction leveling (mm)