多层LCP电路板过孔互联电路模型快速构建
Fast Construction of a Circuit Model for Via-Hole Transition Based on Liquid Crystal Polymer Multilayer Substrate
多层LCP电路板过孔互联电路模型快速构建 |
| 刘维红, 刘烨 |
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Fast Construction of a Circuit Model for Via-Hole Transition Based on Liquid Crystal Polymer Multilayer Substrate |
| LIU Weihong, LIU Ye |
| 图8 ADS等效电路模型和HFSS电磁仿真S参数对比图 |
| Fig.8 Comparisons of S-parameter of ADS equivalent circuit model and HFSS electromagnetic simulation |
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