多层LCP电路板过孔互联电路模型快速构建
Fast Construction of a Circuit Model for Via-Hole Transition Based on Liquid Crystal Polymer Multilayer Substrate
多层LCP电路板过孔互联电路模型快速构建 |
| 刘维红, 刘烨 |
|
Fast Construction of a Circuit Model for Via-Hole Transition Based on Liquid Crystal Polymer Multilayer Substrate |
| LIU Weihong, LIU Ye |
| 图4 多层LCP基板中垂直互联结构集总参数模型 |
| Fig.4 Configuration of lumped parameter model for vertical transition based on muti-layer LCP substrate |
|
|