3D电子封装锡晶须建模与实验验证

王泽坤, 张福曦

Modeling and Experimental Study of Tin Whiskers for 3D Electronic Packaging

WANG Zekun, ZHANG Fuxi

图8 磁控溅射系统产生固有净压缩和拉伸及无固有静态应力膜的条件

Fig.8 Different introduction conditions for static compressive/tensile stress and zero-stress