3D电子封装锡晶须建模与实验验证

王泽坤, 张福曦

Modeling and Experimental Study of Tin Whiskers for 3D Electronic Packaging

WANG Zekun, ZHANG Fuxi

图7 由外应力引起的临界应变的样本模拟

Fig.7 Sample simulation of critical strain at different external stresses