3D电子封装锡晶须建模与实验验证

王泽坤, 张福曦

Modeling and Experimental Study of Tin Whiskers for 3D Electronic Packaging

WANG Zekun, ZHANG Fuxi

图4 模拟外应力分布的载荷设置示例[16]

Fig.4 An example for simulating external load distribution[16]