3D电子封装锡晶须建模与实验验证
王泽坤, 张福曦
Modeling and Experimental Study of Tin Whiskers for 3D Electronic Packaging
WANG Zekun, ZHANG Fuxi
表2
规范化后各结构的具体信息
Tab.2
Normalized details of corresponding structures
形状
r
1
/μm
L
1
/μm
L
2
/μm
S
/μm
2
P
平面
10
62.8 (100%)
0
314
0.200
栅格
10
31.4 (50%)
31.4 (50%)
200
0.157
角部
10
31.4 (50%)
31.4 (50%)
200
0.157
孔#1
10
41.9 (66%)
20.9 (33%)
300
0.140
孔#2
10
22.6 (36%)
40.2 (64%)
200
0.113