收稿日期: 2021-08-18
网络出版日期: 2022-06-21
基金资助
陕西省重点研发计划(2020GY-040)
Fast Construction of a Circuit Model for Via-Hole Transition Based on Liquid Crystal Polymer Multilayer Substrate
Received date: 2021-08-18
Online published: 2022-06-21
液晶高分子聚合物(LCP)以其优异的微波毫米波特性,被广泛应用于高频多层电路板.在多层电路板结构中,为了实现不同层电子器件以及传输线结构的高效互联,设计电学特性优异的过孔互联结构显得尤为重要.近年来,随着多层电路板使用频率的不断升高,过孔互联结构的不连续性问题愈发凸显,因此对其进行快速、准确的电磁建模,可以大大提高微波毫米电路的设计效率.基于4层LCP电路板,针对接地共面波导-带状线-接地共面波导(GCPW-SL-GCPW)结构,提出一种高效、快速的多层电路过孔建模方法.通过对多层结构进行分段建模,在寄生参数提取过程中引入快速收敛算法,建立过孔的集总参数等效电路结构;基于微波网络级联法,完成GCPW-SL-GCPW结构等效电路模型的快速构建.与三维高频电磁软件(HFSS)全波仿真结果进行对比,发现该建模方法过程简单、求解速度快.利用LCP多层工艺,制备了GCPW-SL-GCPW电路结构,测试结果表明,在10 MHz~40 GHz的宽频范围内,测试结果和等效电路分析结果具有高度一致性,验证了该过孔互联建模方法的有效性.
刘维红, 刘烨 . 多层LCP电路板过孔互联电路模型快速构建[J]. 上海交通大学学报, 2022 , 56(11) : 1547 -1553 . DOI: 10.16183/j.cnki.jsjtu.2021.308
Liquid crystal polymer (LCP) with excellent microwave and millimeter-wave properties is widely applied in high frequency multilayer substrates. The design of an excellent via-hole transition in multilayer circuits board is important to employ as an interconnect to route signal traces on different layers or connect components. Recently, with the operating frequency increasing, the problem of discontinuity in the via-hole transition structure has become increasingly prominent. Therefore, electromagnetic modeling of via-plate-pair structures is essential for the design of microwave and millimeter-wave circuits. In this paper, an efficient and fast via-hole transition modeling method for the ground coplanar waveguide-strip line-ground coplanar waveguide(GCPW-SL-GCPW) structure based on the four-layer LCP circuit board is proposed. By segmented modeling of the multilayer structure and introducing a fast convergence algorithm in the parasitic parameter calculation process, a via-hole lumped parameter equivalent circuit structure is established. Finally, the equivalent circuit model of the GCPW-SL-GCPW structure is quickly constructed based on the microwave network cascade method. Compared with the full-wave simulation results of HFSS high frequency structure simulator, which is a 3D high-frequency electromagnetic software, it is found that this modeling process is simple and fast. The GCPW-SL-GCPW circuit structure has been fabricated using the LCP multilayer process. The test results show that the test results and the equivalent circuit analysis results are highly consistent in the wide frequency range of 10 MHz—40 GHz, which verifies the effectiveness of the via-hole transition modeling method.
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