随着电子器件和智能制造不断微型化，极限尺度下的传热问题日益突出.本文讨论热辐射和热传导两种基本传热形式的传统理论在极限尺度下的适用性与统一性问题.提出在极限尺度下，两种传热形式能否有统一的理论描述是解决电子器件热管理和原子级智能制造核心问题的关键.

With the miniaturization of electronic devices and intelligent manufacturing, the problem of heat transfer at ultimate scales is becoming increasingly prominent. Therefore, this paper disscusses the applicability and unification of thermal radiation and thermal conduction at ultimate scales. Moreover, it proposes that it is critical to have a unified theory of heat transfer at ultimate scales, especially for solving the problems in electronics thermal management and atomic-level intelligent manufacturing.