基于数值模拟的芯片冷却散热器结构优化

doi:10.16183/j.cnki.jsjtu.2019.04.010

摘要/Abstract

摘要： 针对计算机芯片冷却的典型散热器进行了三维数值模拟，对比分析了4类散热器的芯片冷却性能及翅片厚度的影响，得到了性能较佳的散热器模型和翅片厚度值.结果表明：散热器对称中心区域换热效果较差，两侧区域换热效果较好，结构设计时可重点考虑对称中心区域的强化传热.相对于A型和B型散热器，采用C型和D型散热器时，对流换热系数有显著提高，C型散热器的基板加热面温度明显降低，芯片冷却效果较佳.翅片厚度为2mm时，A型、B型和C型散热器冷却效果较佳，D型散热器翅片厚度最佳值为 2.5mm.该研究对20种不同结构尺寸的散热器进行定量对比分析，阐述了流动传热特性，为芯片冷却散热器的结构优化设计提供了理论依据和工程指导.

关键词: 芯片冷却, 散热器, 结构优化, 翅片厚度, 数值模拟

Abstract: Three-dimensional numerical simulation of chip cooling radiator was carried out and the performance of four different radiators and influence of fin thickness were contrastively analyzed. Radiator model and fin thickness with better performance were also obtained. The results indicated that the heat transfer effect in both sides of radiator was better than that in the symmetrical central region, which meant that the heat transfer enhancement in the symmetrical central region should be mainly taken into account in the radiator structural design. The heat transfer coefficient of C-type and D-type radiators was obviously improved compared with A-type and B-type radiators. The temperature of substrate heating surface of C-type was much lower and the performance was better. When the fin thickness was 2mm, the cooling effect of A-type, B-type and C-type radiators was better, while the optimum value of D-type radiator was 2.5mm. 20 kinds of radiators with different structural dimensions were comprehensively analyzed in the study and the characteristics of flow and heat transfer were stated, which provided a theoretical basis and engineering guidance for the structural optimization design of chip cooling radiators.

Key words: chip cooling, radiator, structure optimization, fin thickness, numerical simulation

中图分类号:

TK 172

李健，陆繁莉，董威，蔡一凡，许梦玫. 基于数值模拟的芯片冷却散热器结构优化[J]. 上海交通大学学报（自然版）, 2019, 53(4): 461-467.

LI Jian,LU Fanli,DONG Wei,CAI Yifan,XU Mengmei. Structure Optimization of Chip Cooling Radiator Based on Numerical Simulation[J]. Journal of Shanghai Jiaotong University, 2019, 53(4): 461-467.

参考文献

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