上海交通大学学报

上海交通大学学报（自然版）

• 金属学与金属工艺 • 上一篇    下一篇

微晶云母陶瓷微细孔超声加工正交试验

王丹，赵万生，康小明，顾琳，韦红雨   

  1. （上海交通大学 机械与动力工程学院， 上海 200240）
  • 收稿日期:2009-05-06 修回日期:1900-01-01 出版日期:2010-01-29 发布日期:2010-01-29

OrthogonalTesting Experimental on MicroUltrasonicMachining of MicrocrystallineMicaCeramic

WANG Dan,ZHAO Wansheng,KANG Xiaoming,GU Lin,WEI Hongyu   

  1. OrthogonalTesting Experimental on MicroUltrasonicMachining of MicrocrystallineMicaCeramicWANG Dan,ZHAO Wansheng,KANG Xiaoming,GU Lin,WEI Hongyu(School of Mechanical Engineering, Shanghai Jiaotong University, Shanghai 200240, China)Abstract： Microultrasonicmachining (microUSM) experiments were carried out on 530 μmthick microcrystallinemicaceramic（MCMC）slices with workpiece vibration and using silver tungsten alloy as tool materials. The experiments were designed by orthogonaltesting method considering five factors and two levels to investigate the influences of ultrasonic amplitude, tool feed rate, tool rotate speed, abrasive particle size and abrasive concentration on tool volume wear rate in the microUSM of MCMC. Based on the experiments, a 80 μm through hole was machined successfully on 530 μmthick MCMC slice with the optimized microUSM parameters, and the taper of the hole is less than 0.5°.Key words： microultrasonicmachining (microUSM); microcrystallinemicaceramic (MCMC）; orthogonaltesting
  • Received:2009-05-06 Revised:1900-01-01 Online:2010-01-29 Published:2010-01-29

摘要： 采用工件加振方式的微细超声加工方法和银钨合金工具，在厚度530 μm的微晶云母陶瓷圆片上进行微细超声加工试验.通过5因素2水平正交试验分析了超声加工试验中振幅、工具进给速度和转速、工作液中金刚石磨粒粒度及金刚石质量分数对其工具体积损耗率的影响，并选择较优的参数组合，加工出孔径80 μm、深度530 μm、孔侧壁锥度小于0.5°的微晶云母陶瓷通孔.

关键词: 微细超声加工, 微晶云母陶瓷, 正交试验

Abstract: Microultrasonicmachining (microUSM) experiments were carried out on 530 μmthick microcrystallinemicaceramic（MCMC）slices with workpiece vibration and using silver tungsten alloy as tool materials. The experiments were designed by orthogonaltesting method considering five factors and two levels to investigate the influences of ultrasonic amplitude, tool feed rate, tool rotate speed, abrasive particle size and abrasive concentration on tool volume wear rate in the microUSM of MCMC. Based on the experiments, a 80 μm through hole was machined successfully on 530 μmthick MCMC slice with the optimized microUSM parameters, and the taper of the hole is less than 0.5°.

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