多层箔片超声焊接的摩擦能量耗散机理及影响因素研究

doi:10.16183/j.cnki.jsjtu.2020.423

摘要/Abstract

摘要：

在多层金属箔片的超声焊接过程中,焊头压紧金属箔片并带动其发生超声振动,各接触面摩擦生热并产生塑性变形,进而形成固相连接.各层箔片所受载荷存在差异,导致各接触面的摩擦行为和连接质量不一致,从而影响整体焊接质量.因此,需要分析焊接过程中载荷在多层金属箔片中的传递规律,揭示多界面的摩擦状态和能量耗散差异.以5层铜箔的超声焊接为研究对象,基于 Cattaneo-Mindlin 接触理论,利用Abaqus建立二维有限元仿真模型;分析不同压力载荷下各接触面的载荷分布和黏结-滑移状态转化;计算各接触面的摩擦耗散能量总量及在各接触面中的占比,并总结影响因素,给出多层金属箔片超声波焊接的理论工艺优化方法.

关键词: 超声波焊接, 多界面摩擦, 黏结-滑移转化, 摩擦能量耗散, 有限元仿真

Abstract:

In multilayer ultrasonic welding, the sonotrode presses on metal sheets and drives the sheets to produce ultrasonic vibration. Then, each contact interface generates heat, produces plastic deformation, and forms solid-state bonding. However, the load distributes unevenly in each sheet, which results in the uneven friction state and inconsistent welding quality. Hence, it is necessary to reveal the mechanism of frictional state and energy dissipation based on the load distribution in each sheet. A finite element model of 5-layer copper sheets is established using Abaqus and considering the Cattaneo-Mindlin contact theory. The clamping force and ultrasonic vibration in each interface is simulated. The slip-stick state of each interface is obtained and the effect of the clamping force are analyzed. The frictional energy dissipation and proportion of each interface are calculated, the influencing factors of frictional energy dissipation are summarized, and the optimization of input clamping force is discovered, which can provide theoretical guidance for the improvement of multilayer ultrasonic welding.

Key words: ultrasonic welding, multilayer friction, slip-stick state, frictional energy dissipation, finite element method (FEM)

中图分类号:

TG44
TG456

马遵农, 张延松, 赵亦希. 多层箔片超声焊接的摩擦能量耗散机理及影响因素研究[J]. 上海交通大学学报, 2022, 56(6): 772-783.

MA Zunnong, ZHANG Yansong, ZHAO Yixi. Mechanism and Influencing Factors of Frictional Energy Dissipation in Multilayer Ultrasonic Welding[J]. Journal of Shanghai Jiao Tong University, 2022, 56(6): 772-783.

图/表 18

图1

表1

考虑声致软化的J-C模型参数

A/MPa	B/MPa	C	m	n	$ε · 0$	T_room/℃	T_melt/℃
116	292	0.025	0.638	0.31	1	20	1083

表1

图2

表2

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条件	Δx'_i_,_j<0	Δx'_i_,_j=0	Δx'_i_,_j>0
Δy_i_,_j>0	分离	分离	分离
Δy_i_,_j≤0	向左滑移	黏结	向右滑移